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Toplam kayıt 6, listelenen: 1-6
Forward-viewing CMUT arrays for medical Imaging
(IEEE-INST Electrical Electronics Engineers Inc, 2004-07)
This paper reports the design and testing of forward-viewing annular arrays fabricated using capacitive micromachined ultrasonic transducer (CMUT) technology. Recent research studies have shown that CMUTs have broad frequency ...
Multiple annular ring capacitive micromachined ultrasonic transducer arrays for forward-looking intravascular ultrasound imaging catheters
(American Society of Mechanical Engineers (ASME), 2007)
We investigate multiple-annular-ring CMUT array configuration for forward-looking intravascular ultrasound (FL-IVUS) imaging. This configuration has the potential for independent optimization of each ring and uses the ...
Dual electrode capacitive micromachined ultrasonic transducer array for 1-D intracardiac echocardiography (ICE)
(American Society of Mechanical Engineers (ASME), 2007)
We designed and fabricated a 64 element 1-D linear dual electrode Capacitive Micromachined Ultrasonic Transducer (CMUT) array operating at 9.5 MHz for Intracardiac Echocardiography (ICE). The dual electrode CMUT structure ...
A miniature real-time volumetric ultrasound imaging system
(SPIE-Int Soc Optical Engineering, 2005)
Progress made in the development of a miniature real-time volumetric ultrasound imaging system is presented. This system is targeted for use in a 5-mm endoscopic channel and will provide real-time, 30-mm deep, volumetric ...
Micromachined capacitive transducer arrays for intravascular ultrasound
(SPIE, 2005)
Intravascular ultrasound (IVUS) imaging has become an essential imaging modality for the effective diagnosis and treatment of cardiovascular diseases during the past decade enabled by innovative applications of piezoelectric ...
Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results
(IEEE, 2002)
This paper presents the first volumetric images obtained using a 2D CMUT array with through-wafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in ...