Konu "Wideband amplifiers" için MF - Bildiri Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering listeleme
Toplam kayıt 6, listelenen: 1-6
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Broadband matching of PA-To-PCB interconnection for X-band wireless power transfer
(Institute of Electrical and Electronics Engineers Inc., 2019-08)Design and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies ... -
A broadband microwave amplifier design by means of immittance based data modelling tool
(IEEE, 2002)In this paper a practical broadband microwave amplifier design algorithm is introduced utilizing the immittance data-modelling tool. In the course of design, first, the optimum input and output terminations for the active ... -
A computer aided design technique for hybrid and monolithic microwave amplifiers employing distributed equalizers with lumped discontinuities
(IEEE, 2001)This paper will addres the use of mixed lumped and distributed elements in the matching equalizers of microwave amplifers for hybrid and monolithic MIC realizations. In this work we show how the computer aided real frequency ... -
Design of a broadband microwave amplifier constructed with mixed lumped and distributed elements for mobile communication
(IEEE, 2002)In this paper, we designed a broadband microwave amplifier utilizing. the "semi-analytic method to describe symmetrical lossless two-ports with two-kinds of elements", namely, distributed and lumped elements in cascade ... -
Microwave amplifier design for mobile communication via immittance data modelling
(IEEE, 2003)In this paper, a practical broadband microwave amplifier design algorithm based on immittance data modelling is presented. In the course of design, first, the optimum input and output terminations for the active device are ... -
A tunable inductance topology to realize frequency tunable matching networks and amplifiers
(IEEE, 2013)Coverage of commercial communication standards such as GSM, UMTS, Wi-Fi and Wi-Max within a single transceiver chip is one of the most desired properties by wireless communication manufacturers. In this regard, communication ...