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Toplam kayıt 15, listelenen: 1-10
Minimally redundant 2-D array designs for 3-D medical ultrasound imaging
(IEEE-Inst Electrical Electronics Engineers Inc, 2009-07)
In real-time ultrasonic 3-D imaging, in addition to difficulties in fabricating and interconnecting 2-D transducer arrays with hundreds of elements, there are also challenges in acquiring and processing data from a large ...
An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging
(IEEE-INST Electrical Electronics Engineers Inc, 2009-10)
State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array ...
Volumetric ultrasound imaging using 2-D CMUT arrays
(IEEE-Inst Electrical Electronics Engineers Inc, 2003-11)
Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first ...
Forward-viewing CMUT arrays for medical Imaging
(IEEE-INST Electrical Electronics Engineers Inc, 2004-07)
This paper reports the design and testing of forward-viewing annular arrays fabricated using capacitive micromachined ultrasonic transducer (CMUT) technology. Recent research studies have shown that CMUTs have broad frequency ...
Coherent array imaging using phased subarrays. Part II: Simulations and experimental results
(IEEE-INST Electrical Electronics Engineers Inc, 2005-01)
The basic principles and theory of phased subarray (PSA) imaging imaging provides the flexibility of reducing I he number of front-end hardware channels between that of classical synthetic aperture (CSA) imaging-which uses ...
Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging
(IEEE-INST Electrical Electronics Engineers Inc, 2008-02)
For three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and ...
An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: testing and characterization
(IEEE, 2007)
The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky ...
An integrated circuit with transmit beamforming and parallel receive channels for real-time three-dimensional ultrasound imaging
(IEEE, 2006)
We present the design of an integrated circuit (IC) that will be flip-chip bonded to a 16 x 16-element CMUT array. The IC provides 16 receive channels which can be configured to receive along either of the array diagonals ...
Beamforming and hardware design for a multichannel front-end integrated circuit for real-time 3D catheter-based ultrasonic imaging
(SPIE-Int Soc Optical Engineering, 2006)
We are working on integrating front-end electronics with the ultrasound transducer array for real-time 3D ultrasound imaging systems. We achieve this integration by flip-chip bonding a two-dimensional transducer array to ...
Volumetric imaging using fan-beam scanning with reduced redundancy 2D arrays
(IEEE, 2006)
Phased array processing with a fully populated 2D array produces the best image quality but requires excessive number of active parallel front-end channels. Here we explore four array designs with reduced redundancy in ...