Basit öğe kaydını göster

dc.contributor.authorZahorian, Jaime S.en_US
dc.contributor.authorHochman, Michaelen_US
dc.contributor.authorXu, Tobyen_US
dc.contributor.authorSatır, Sarpen_US
dc.contributor.authorGürün, Gökçeen_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorDeğertekin, Fahrettin Leventen_US
dc.date.accessioned2015-01-15T23:01:50Z
dc.date.available2015-01-15T23:01:50Z
dc.date.issued2011-12
dc.identifier.citationZahorian, J., Hochman, M., Xu, T., Satir, S., Gurun, G., Karaman, M., & Degertekin, F. L. (2011). Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 58(12), 2659-2667. doi:10.1109/TUFFC.2011.2128en_US
dc.identifier.issn0885-3010
dc.identifier.urihttps://hdl.handle.net/11729/394
dc.identifier.urihttp://dx.doi.org/10.1109/TUFFC.2011.2128
dc.descriptionwork was supported by the National Institutes of Health under the grants HL082811 and EB010070en_US
dc.description.abstractOne of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.en_US
dc.language.isoengen_US
dc.publisherIEEE-INST Electrical Electronics Engineers Incen_US
dc.relation.isversionof10.1109/TUFFC.2011.2128
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectChronic total occlusionsen_US
dc.subjectFront-end electronicsen_US
dc.subjectArraysen_US
dc.subjectTransducersen_US
dc.subjectFutureen_US
dc.subjectFabricationen_US
dc.subjectMetalsen_US
dc.subjectSurface topographyen_US
dc.subjectSurface treatmenten_US
dc.subjectWiresen_US
dc.subjectElectronicsen_US
dc.subjectEquipment Designen_US
dc.subjectEquipment failure analysisen_US
dc.subjectImage enhancementen_US
dc.subjectMicro-electrical-mechanical systemsen_US
dc.subjectMiniaturizationen_US
dc.subjectReproducibility of resultsen_US
dc.subjectSemiconductorsen_US
dc.subjectSensitivity and specificityen_US
dc.subjectSystems integrationen_US
dc.titleMonolithic CMUT-on-CMOS integration for intravascular ultrasound applicationsen_US
dc.typearticleen_US
dc.description.versionPublisher's Versionen_US
dc.relation.journalIEEE Transactions on Ultrasonics Ferroelectrics and Frequency Controlen_US
dc.contributor.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.contributor.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.identifier.volume58
dc.identifier.issue12
dc.identifier.startpage2659
dc.identifier.endpage2667
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.contributor.institutionauthorKaraman, Mustafaen_US
dc.relation.indexWOSen_US
dc.relation.indexScopusen_US
dc.relation.indexPubMeden_US
dc.relation.indexScience Citation Index Expanded (SCI-EXPANDED)en_US
dc.description.qualityQ1
dc.description.wosidWOS:000300092800017
dc.description.pubmedidPMID:23443701


Bu öğenin dosyaları:

Thumbnail

Bu öğe aşağıdaki koleksiyon(lar)da görünmektedir.

Basit öğe kaydını göster