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  •   DSpace@Işık
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  • Mühendislik Fakültesi / Faculty of Engineering
  • Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
  • MF - Bildiri Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
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Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress

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Date

2004

Author

Wygant, Ira O.
Zhuang, Xuefeng
Yeh, David T.
Nikoozadeh, Amin
Oralkan, Ömer
Ergün, Arif Sanlı
Karaman, Mustafa
Khuri-Yakub, Butrus Thomas

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Citation

Wygant, I. O., Zhuang, X., Yeh, D. T., Nikoozadeh, A., Oralkan, O., Ergün, A. S., . . . Khuri-Yakub, B. T. (2004). Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress. Paper presented at the , 1 391-394 Vol.1. doi:10.1109/ULTSYM.2004.1417745

Abstract

This paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware.

Source

Proceedings - IEEE Ultrasonics Symposium

Volume

1

URI

https://hdl.handle.net/11729/2044
https://dx.doi.org/10.1109/ULTSYM.2004.1417745

Collections

  • MF - Bildiri Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering [222]
  • Scopus İndeksli Bildiri Koleksiyonu [456]

Related items

Showing items related by title, author, creator and subject.

  • An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: testing and characterization 

    Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Zhuang, Xuefeng; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus Thomas (IEEE, 2007)
    The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky ...
  • Forward-looking IVUS imaging using a dual-annular ring CMUT array: Experimental results 

    Güldiken, Rasim Oytun; Zahorian, Jaime S.; Gürün, Gökçe; Qureshi, Muhammad Shakeel; Balantekin, Müjdat; Tekeş, Coşkun; Hasler, Paul E.; Karaman, Mustafa; Carlier, Stephane; Değertekin, Fahrettin Levent (IEEE, 2007)
    This paper presents the experimental results on forward-looking Intravascular ultrasound (FL-IVUS) using dual-annular-ring CMUT arrays. The array has a diameter of 1mm including bondpads which consists of separate, concentric ...
  • Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results 

    Oralkan, Ömer; Ergün, Arif Sanlı; Cheng, Ching-Hsiang; Johnson, Jeremy A.; Karaman, Mustafa; Lee, Thomas H.; Khuri-Yakub, Butrus Thomas (IEEE, 2002)
    This paper presents the first volumetric images obtained using a 2D CMUT array with through-wafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in ...



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