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dc.contributor.authorWygant, Ira O.en_US
dc.contributor.authorZhuang, Xuefengen_US
dc.contributor.authorYeh, David T.en_US
dc.contributor.authorOralkan, Ömeren_US
dc.contributor.authorErgün, Arif Şanlıen_US
dc.contributor.authorKaraman, Mustafaen_US
dc.contributor.authorKhuri-Yakub, Butrus T.en_US
dc.date.accessioned2015-01-15T23:01:07Z
dc.date.available2015-01-15T23:01:07Z
dc.date.issued2008-02
dc.identifier.issn0885-3010
dc.identifier.otherWOS:000253358700008
dc.identifier.urihttps://hdl.handle.net/11729/301
dc.identifier.urihttp://dx.doi.org/10.1109/TUFFC.2008.652
dc.description.abstractFor three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 mPa/root Hz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.en_US
dc.language.isoengen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.relation.isversionof10.1109/TUFFC.2008.652
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.sourceIeee Transactions on Ultrasonics Ferroelectrics and Frequency Controlen_US
dc.subjectReal-timeen_US
dc.subject2-dimensional arraysen_US
dc.subjectTransducersen_US
dc.subjectSystemen_US
dc.subjectInterconnecten_US
dc.subjectFabricationen_US
dc.subjectTechnologyen_US
dc.subjectCircuiten_US
dc.subjectDesignen_US
dc.titleIntegration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imagingen_US
dc.typearticleen_US
dc.description.versionPublisher's Versionen_US
dc.contributor.departmentIşık Üniversitesi, Mühendislik Fakültesi, Elektrik-Elektronik Mühendisliği Bölümüen_US
dc.contributor.departmentIşık University, Faculty of Engineering, Department of Electrical-Electronics Engineeringen_US
dc.contributor.authorIDTR9425
dc.identifier.volume55
dc.identifier.issue2
dc.identifier.startpage327
dc.identifier.endpage342
dc.peerreviewedYesen_US
dc.publicationstatusPublisheden_US
dc.relation.publicationcategoryBelirsizen_US
dc.contributor.institutionauthorKaraman, Mustafa


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