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  • Mühendislik Fakültesi / Faculty of Engineering
  • Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
  • MF - Makale Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
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  •   DSpace@Işık
  • 1- Fakülteler | Faculties
  • Mühendislik Fakültesi / Faculty of Engineering
  • Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
  • MF - Makale Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering
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An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

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Date

2009-10

Author

Wygant, Ira O.
Jamal, Nafis S.
Lee, Hyunjoo
Nikoozadeh, Amin
Oralkan, Ömer
Karaman, Mustafa
Khuri-Yakub, Butrus T.

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Citation

Wygant, I., Wygant, I., Jamal, N., Jamal, N., Lee, H., Lee, H., . . . Khuri-yakub, B. (2009). An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 56(10), 2145-2156. doi:10.1109/TUFFC.2009.1297

Abstract

State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.

Source

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

Volume

56

Issue

10

URI

https://hdl.handle.net/11729/319
http://dx.doi.org/10.1109/TUFFC.2009.1297

Collections

  • MF - Makale Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering [166]
  • PubMed İndeksli Yayın Koleksiyonu [87]
  • Scopus İndeksli Makale Koleksiyonu [799]
  • WoS İndeksli Makale Koleksiyonu [818]



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