Künye "Wygant, I., Jamal, N., Lee, H. J.., . . .& Khuri-yakub, B. T. (2009). An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 56(10), 2145-2156. doi:10.1109/TUFFC.2009.1297" MF - Makale Koleksiyonu | Elektrik-Elektronik Mühendisliği Bölümü / Department of Electrical-Electronics Engineering için listeleme
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An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging
(IEEE-INST Electrical Electronics Engineers Inc, 2009-10)State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array ...