Yazar "Jamal, Nafis S." seçeneğine göre listele

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    An integrated circuit with transmit beamforming and parallel receive channels for 3D ultrasound imaging: testing and characterization
    (IEEE, 2007) Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Zhuang, Xuefeng; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus Thomas
    The cost and complexity of medical ultrasound imaging systems can be reduced by integrating the transducer array with an integrated circuit (IC). By incorporating some of the system's front-end electronics into an IC, bulky cables and costly system electronics can be eliminated. Here we present an IC for 3D intracavital imaging that requires few electrical connections but uses a large fraction of a 16x16-element 2D transducer array to transmit focused ultrasound. To simplify the receive and data acquisition electronics, only the 32 elements along the array diagonals are used as receivers. The IC provides a preamplifier for each receiving element. Each of the 224 transmitting elements is provided an 8-bit shift register, a comparator, and a 25-V pulser. To transmit, a global counter is incremented from 1 to 224; each pulser fires when its stored register value is equal to the global count value. Electrical testing of the fabricated IC shows that it works as designed. The IC was flip-chip bonded to a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. A two-dimensional image of a wire target phantom was acquired.
  • Küçük Resim
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    An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging
    (IEEE-INST Electrical Electronics Engineers Inc, 2009-10) Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Oralkan, Ömer; Karaman, Mustafa; Khuri-Yakub, Butrus Thomas
    State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated property timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (B-scans) of a latex heart phantom.