Design trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applications
Yükleniyor...
Tarih
2022-03-24
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
IEEE
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
This paper investigates printed circuit board (PCB) design trade-offs and considerations to maximize the current carrying capacity of traces in PCB-based power electronics applications. Many existing designs rely on methodologies through empirical data presented by the outdated IPC-2152 standard. A design methodology to maximize the utilized PCB area and improve thermal performance is introduced. To assess this methodology, lumped parameter (LP) and finite element (FE) models are developed and computational fluid dynamics (CFD) simulations are carried out. Thermal via placement strategies are investigated and maximum allowable power dissipation on the PCB traces is calculated. Simulations and analyses are experimentally validated on a PCB-based 100kW three-phase three-level inverter. The that results show that the thermal and electrical models discussed in this paper have superior accuracy compared to traditional formulations.
Açıklama
Anahtar Kelimeler
IPC-2152, PCB ampacity, PCB design methodologies, Power electronics, Thermal vias, Commerce, Computational fluid dynamics, Design, Economic and social effects, Ampacity, Design methodology, Design tradeoff, Power-electronics, Printed circuit board ampacity, Printed circuit board design methodology, Printed circuit board designs, Printed circuit boards, Power system measurements, Semiconductor device measurement, Density measurement, Thermal resistance, Computational modeling, Cooling, Design engineering, Finite element analysis, Printed circuit design, Printed circuits, Thermal management (packaging), Electrical models, Thermal models, PCB traces, Maximum allowable power dissipation, Computational fluid dynamics simulations, Thermal performance, Utilized PCB area, Outdated IPC-2152 standard, Empirical data, PCB-based power electronics applications, Circuit board design trade-offs, High power density power electronics applications, PCB current carrying capacity
Kaynak
2022 IEEE Applied Power Electronics Conference and Exposition (APEC)
WoS Q Değeri
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N/A
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Sayı
Künye
Büyükdeğirmenci, Veysel T., Kozarva, Ö. F., Milletsever, Ö. C. & Hava, A. M. (2022). Design trade-offs and considerations for improving the PCB current carrying capacity in high power density power electronics applications. Paper presented at the 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 1678-1685. doi:10.1109/APEC43599.2022.9773486
