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Yayın Volumetric ultrasound imaging using 2-D CMUT arrays(IEEE-Inst Electrical Electronics Engineers Inc, 2003-11) Oralkan, Ömer; Ergün, Arif Sanlı; Cheng, Ching-Hsiang; Johnson, Jeremy A.; Karaman, Mustafa; H. Lee, Thomas; Khuri-Yakub, Butrus ThomasRecently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-mum element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 X 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 X 16-element portion of the array to surrounding bondpads. An 8 x 16-element poition of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 X 4 group of elements in the middle of the 8 X 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.Yayın Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays(IEEE-INST Electrical Electronics Engineers Inc, 2005-12) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaIntegration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.Yayın Subarray delta-sigma beamforming for ultrasonic imaging(IEEE, 2002) Bilge, Hasan Şakir; Karaman, MustafaWe present a beamforming architecture based on subarray processing with non-uniform oversampling 1-bit delta-sigma (??) modulation. The subarray processing combines conventional phased array and synthetic aperture approaches to form a large aperture using small subarrays thus reduces active channel count. ??-based beamforming improves the efficiency of front-end processing further: oversampling permits precise delaying and single bit data processing simplifies beamforming operation. To reduce the number of firings we use a low beam density associated with the subarray size, and then increase the beam density by lateral interpolation prior to coherent beam summation. Our experimental test results show that the proposed scheme provides high-resolution beamforming while simplifying the front-end.Yayın A lumped circuit model for the radiation impedance of a 2D CMUT array element(IEEE, 2005) Bozkurt, Ayhan; Karaman, MustafaElements of a 2D array used for 3D acoustic imaging have dimensions smaller than half of the acoustic wavelength due to the Nyquist criteria for spatial sampling. Therefore, analyses involving circuit models for the array elements have to account for the reactive part of the radiation impedance of the array element. In this paper, we introduce a lumped circuit model for the complex radiation impedance of a 2D CMUT array element. Using the finite element method (FEM) we first show that the radiation impedance of the array element is identical to that of a plane piston transducer of comparable dimensions. Then, we show that the complex radiation impedance of the 2D array element can be represented by a simple resonant circuit placed parallel to the real radiation impedance in the Mason's equivalent circuit. The component values of the reactive lumped elements forming the resonant circuit were determined by fitting the impedance of overall equivalent circuit to the FEM results using the Nelder-Mead minimization algorithm.
