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Yayın Phased subarray imaging for low-cost, wideband coherent array imaging(IEEE, 2003) Johnson, Jeremy A.; Oralkan, Ömer; Ergün, Arif Sanlı; Demirci, Utkan; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThe front-end hardware complexity of conventional full phased array (FPA) imaging is proportional to the number of array elements. Phased subarray (PSA) imaging has been proposed as a method of reducing the hardware complexity-and therefore system cost and size-while achieving near-FPA image quality. A new method is presented for designing the subarray-dependent interpolation filters suitable for wideband PSA imaging. The method was tested experimentally using pulse-echo data of a wire target phantom acquired using a 3.2-cm. 128-element capacitive micromachined ultrasonic transducer (CMUT) array with 85% fractional bandwidth at 3 MHz. A specific PSA configuration using seven 32-element subarrays was compared to FPA imaging, representing a 4-fold reduction in front-end hardware complexity and a 43% decrease in frame rate. For targets near the fixed transmit focal distance, the mean 6-dB lateral resolution was identical to that of FPA, the axial resolution improved by 4%, and the SNR decreased by 5 dB. Measurements were repeated for 10 different PSA configurations with subarray sizes ranging from 4 to 60. The lateral and axial resolutions did not vary significantly with subarray size; both the SNR and contrast-to-noise ratio (CNR) improved with increased subarray size.Yayın Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress(IEEE, 2004) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Nikoozadeh, Amin; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThis paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware.Yayın Dual-annular-ring CMUT array for forward-looking IVUS imaging(IEEE, 2006) Güldiken, Rasim Oytun; Zahorian, Jaime; Balantekin, Müjdat; Değertekin, Fahrettin Levent; Tekeş, Coşkun; Şişman, Alper; Karaman, MustafaWe investigate a dual-annular-ring CMUT array configuration for forward-looking intravascular ultrasound (FL-IVUS) imaging. The array consists of separate, concentric transmit and receive ring arrays built on the same silicon substrate. This configuration has the potential for independent optimization of each array and uses the silicon area more effectively without any particular drawback. We designed and fabricated a 1mm diameter test array which consists of 24 transmit and 32 receive elements. We investigated synthetic phased array beamforming with a non-redundant subset (if transmit-receive element pairs of the dual-annular-ring array. For imaging experiments, we designed and constructed a programmable FPGA-based data acquisition and phased array beamforming system. Pulse-echo measurements along with imaging simulations suggest that dual-ring-annular array should provide performance suitable for real-time FLAVUS applications.Yayın Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays(IEEE-INST Electrical Electronics Engineers Inc, 2005-12) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaIntegration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.Yayın Forward-looking IVUS imaging using a dual-annular ring CMUT array: Experimental results(IEEE, 2007) Güldiken, Rasim Oytun; Zahorian, Jaime S.; Gürün, Gökçe; Qureshi, Muhammad Shakeel; Balantekin, Müjdat; Tekeş, Coşkun; Hasler, Paul E.; Karaman, Mustafa; Carlier, Stephane; Değertekin, Fahrettin LeventThis paper presents the experimental results on forward-looking Intravascular ultrasound (FL-IVUS) using dual-annular-ring CMUT arrays. The array has a diameter of 1mm including bondpads which consists of separate, concentric 24 transmit and 32 receive ring arrays built on the same silicon substrate. This configuration has the potential for Independent optimization of each array and uses the silicon area more effectively without any drawback. For imaging experiments, we designed and constructed a custom integrated circuit using a standard 0.5 mu m CMOS process for data acquisition. A sample pulse-echo signal received from the oil-air Interface (plane reflector) at 6mm had a center frequency of 11MHz with 95% fractional 6-dB bandwidth. The measured SNR of the echo was 24 dB with no averaging. B-scan image of a wire-phantom was generated to test the resolution.Yayın Annular CMUT arrays for side looking intravascular ultrasound imaging(IEEE, 2007) Zahorian, Jaime; Güldiken, Rasim Oytun; Gürün, Gökçe; Qureshi, Muhammad Shakeel; Balantekin, Müjdat; Değertekin, Fahrettin Levent; Carlier, Stephane; Şişman, Alper; Karaman, MustafaAlthough side looking intravascular ultrasound (SL-IVUS) imaging systems using single element piezoelectric transducers set the resolution standard in the assessment of the extent of coronary artery disease, improvements in transducer performance are needed to perform harmonic imaging and high resolution imaging of vulnerable plaque. With their small channel count; annular arrays exploiting the inherent broad bandwidth of CMUTs and electronic focusing capability of integrated electronics provide a path for desired SL-IVUS imaging catheters. In this paper, we first describe the design, low temperature fabrication of an 8401 mu m diameter, 8 element CMUT annular array. Testing of the individual elements in oil shows a uniform device behavior with 100% fractional bandwidth around 20MHz without including the effects of attenuation and diffraction. We also present linear scan imaging results obtained on wire targets in oil, tissue and tissue mimicking phantoms using both unfocused and dynamically focused transducers. The results for axial and lateral resolution are in agreement predicted by the simulations and show the feasibility of this approach for high resolution SL-IVUS imaging.Yayın Coherent array imaging using phased subarrays. Part II: Simulations and experimental results(IEEE-INST Electrical Electronics Engineers Inc, 2005-01) Johnson, Jeremy A.; Oralkan, Ömer; Ergün, Arif Sanlı; Demirci, Utkan; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThe basic principles and theory of phased subarray (PSA) imaging imaging provides the flexibility of reducing I he number of front-end hardware channels between that of classical synthetic aperture (CSA) imaging-which uses only one element per firing event-and full-phased array (FPA,) imaging-which uses all elements for each firing. The performance of PSA generally ranges between that obtained by CSA and FPA using the same array, and depends on the amount of hardware complexity reduction. For the work described in this paper, we performed FPA, CSA, and PSA imaging of a resolution phantom using both simulated and experimental data from a 3-MHz, 3.2-cm, 128-element capacitive micromachined ultrasound transducer (CMUT) array. The simulated system point responses in the spatial and frequency domains are presented as a means of studying the effects of signal bandwidth, reconstruction filter size, and subsampling rate on the PSA system performance. The PSA and FPA sector-scanned images were reconstructed using the wideband experimental data with 80% fractional bandwidth, with seven 32-element subarrays used for PSA imaging. The measurements on the experimental sector images indicate that, at the transmit focal zone, the PSA method provides a 10% improvement in the 6-dB lateral resolution, and the axial point resolution of PSA imaging is identical to that of FPA imaging. The signal-to-noise ratio (SNR) of PSA image was 58.3 dB, 4.9 dB below that of the FPA image, and the contrast-to-noise ratio (CNR) is reduced by 10%. The simulated and experimental test results presented in this paper validate theoretical expectations and illustrate the flexibility of PSA imaging as a way to exchange SNR and frame rate for simplified front-end hardware.Yayın Üç boyutlu akustik görüntüleme için ön alıcı-verici tümdevre(IEEE, 2004) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaTıbbi ultrasonik görüntüleme sistemleri, genel olarak bir çevirici elemanı ve akustik işaretin üretilip algılanmasından sorumlu elektronik oluşmaktadır. Tek boyutlu dönüştürücü dizileriyle, incelenmekte olan ortamın iki boyutlu kesit görüntüsü elde edilmektedir. Dönüştürücü teknolojisindeki son gelişmelerle, iki boyutlu dönüştürücü dizilerinin üretimi gerçekleştirilmiş, böylece üç boyutlu (hacimsel) görüntüleme yapılması mümkün olmuştur[1,2]. Ancak, özellikle Nyquist kriteri, dönüştürücü elemanların boyutlarını sınırladığı için, eleman boyutları oldukça küçülmüştür; bu da algılanan işareti oldukça zayıflatmaktadır. Bu nedenle, kabul edilebilir nitelikteki görüntülerin alınabilmesi için, alıcı-verici elektroniğinin iyileştirilmesi gerekmektedir. Bu çalışmada, iki boyutlu akustik çeviriciler için CMOS tabanlı ön alıcı-verici devresinin tasarımı gerçekleştirilmiştir. Devre, temel olarak, bir yüksek gerilim darbe üretici, alıcı-verici anahtarı, düşük gürültülü ön yükseltici ve dönüştürücü elemanın bağlantı dolgulamasından oluşmaktadır.Yayın Volumetric imaging using fan-beam scanning with reduced redundancy 2D arrays(IEEE, 2006) Wygant, Ira; Karaman, Mustafa; Oralkan, Ömer; Khuri-Yakub, Butrus ThomasPhased array processing with a fully populated 2D array produces the best image quality but requires excessive number of active parallel front-end channels. Here we explore four array designs with reduced redundancy in spatial frequency contents. To minimize the number of firings we employ fan-beam processing, where ID arrays are used to insonify 2D planar slices of the volume at successive firing events; echo signals are collected by the receive array elements. The array designs are compared based on simulated point spread functions, frame rate, motion susceptibility, and signal-to-noise ratio.Yayın Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results(IEEE, 2002) Oralkan, Ömer; Ergün, Arif Sanlı; Cheng, Ching-Hsiang; Johnson, Jeremy A.; Karaman, Mustafa; Lee, Thomas H.; Khuri-Yakub, Butrus ThomasThis paper presents the first volumetric images obtained using a 2D CMUT array with through-wafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in the experiments. This study experimentally demonstrates that 2D CMUT arrays can be fabricated with high yield using silicon micromachining processes, individual electrical connections can be provided using through-wafer interconnects, and the flip-chip bonding technique can be used to integrate the dense 2D arrays with electronic circuits for practical imaging applications.
