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Yayın Integrated ultrasonic imaging systems based on CMUT arrays: Recent progress(IEEE, 2004) Wygant, Ira O.; Zhuang, Xuefeng; Yeh, David T.; Nikoozadeh, Amin; Oralkan, Ömer; Ergün, Arif Sanlı; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasThis paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, will be connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware will provide real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. This paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array, custom-designed integrated circuits, a flip-chip bonding technique, and signal-processing hardware.Yayın Design of a broadband microwave amplifier constructed with mixed lumped and distributed elements for mobile communication(IEEE, 2002) Yarman, Bekir Sıddık Binboğa; Çimen, Ebru GürsuIn this paper, we designed a broadband microwave amplifier utilizing. the "semi-analytic method to describe symmetrical lossless two-ports with two-kinds of elements", namely, distributed and lumped elements in cascade connection. It is expected that the results presented in this paper will find immediate application to design analog/digital mobile communication systems put on MMICs or VLSI chips.Yayın Design of a new low loss fully CMOS tunable floating active inductor(Springer New York LLC, 2016-12) Momen, Hadi Ghasemzadeh; Yazgı, Metin; Köprü, Ramazan; Saatlo, Ali NaderiIn this paper, a new tunable floating active inductor based on a modified tunable grounded active inductor is proposed. The multi regulated cascade stage is used in the proposed active structure to decrease the parasitic series resistance of active inductor, thus the Q factor enhancement is obtained. Furthermore, the arrangement of this stage leads to the smaller input transistor which determines active inductor’s self-resonance frequency and to be free of body effect which is crucial in sub-micron technology. Symmetrical design strategy has enabled both ports of the proposed floating active inductor to demonstrate the same properties. The Q factor and active inductor value are tuned with bias current and flexible capacitance (varactor), respectively. The self-resonance frequency of floating active inductor (~6.2 GHz) is almost the same as grounded prototype. In addition, the proposed active inductor also shows higher quality factor and inductance value compared to the conventional floating active inductor circuits. To show the performance of suggested circuit, simulations are done by using a 0.18 µm CMOS process, which demonstrates an adjustable quality factor of 10–567 with an inductance value range of 6–284 nH. Total DC power consumption and occupied area are 2 mW and 934.4 µm2, respectively.Yayın Designing a new high Q fully CMOS tunable floating active inductor based on modified tunable grounded active inductor(Institute of Electrical and Electronics Engineers Inc, 2015) Momen, Hadi Ghasemzadeh; Yazgı, Metin; Köprü, RamazanA new Tunable Floating Active Inductor (TFAI) based on modified Tunable Grounded Active Inductor (TGAI) is proposed. Multi regulated cascade stage is used in TGAI to boost gain of input impedance and inductor value thus the Q factor enhancement obtained. The arrangement of Multi-Regulated Cascade (MRC) stage is caused the input transistor which determines AI self-resonance frequency to be as small as possible and it is free of body effect which is crucial in sub-micron technology. Compared to traditional CMOS spiral inductors, the active inductor proposed in this paper can substantially improve its equivalent inductance and quality factor. This TFAI was designed using the AMS 0.18 um RF CMOS process, which demonstrates an adjustable quality factor of 10?567 with a 6?284 nH inductance. The Q factor and value of active inductor is adjusted with bias current and flexible capacitance (varactor), respectively. The self-resonance frequency for both grounded and floating AI is about 6.2 GHz. The proposed active inductor also shows wide dynamic range and higher quality factor compared to conventional floating active inductor circuits.Yayın Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays(IEEE-INST Electrical Electronics Engineers Inc, 2005-12) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaIntegration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 x 4 array of the designed circuit cells, each cell occupying a 200 x 200 mu m(2) area, was formed for the initial test studies and scheduled for fabrication in 0.8 mu m, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.Yayın A method for low-pass filter designing by commensurate transmission lines(IEEE, 2016) Momen, Hadi Ghasemzadeh; Köprü, RamazanIt is well known that the complex Richards-Plane is a transformed domain of Laplace-Plane which is obtained under a tangent hyperbolic mapping. Network functions generated in terms of Richards's frequency are periodic in actual frequencies with periodicity of pi. Once a low-pass prototype network function is designed in Richards's domain, then its periodic feature makes the corresponding periodic band-pass network function to appear at the certain bands repetitively in the frequency axis. Depend on the application requirements, designer can choose the interested band among these repetitive bands. In this work, a filter is built with microstrip commensurate transmission lines in GSM operation pass-band (0.8 <= f <= 2.4 GHz) . This network can be used in communication applications which are designed to operate in the range of GHz as well as the application in a microstrip patch antenna. In the proposed design, Simplified Real Frequency Technique (SRFT) is employed in the frequency detection network, and the simulation result of microwave office tool (AWR) confirms the theoretical result obtained by MATLAB.Yayın Üç boyutlu akustik görüntüleme için ön alıcı-verici tümdevre(IEEE, 2004) Çiçek, İhsan; Bozkurt, Ayhan; Karaman, MustafaTıbbi ultrasonik görüntüleme sistemleri, genel olarak bir çevirici elemanı ve akustik işaretin üretilip algılanmasından sorumlu elektronik oluşmaktadır. Tek boyutlu dönüştürücü dizileriyle, incelenmekte olan ortamın iki boyutlu kesit görüntüsü elde edilmektedir. Dönüştürücü teknolojisindeki son gelişmelerle, iki boyutlu dönüştürücü dizilerinin üretimi gerçekleştirilmiş, böylece üç boyutlu (hacimsel) görüntüleme yapılması mümkün olmuştur[1,2]. Ancak, özellikle Nyquist kriteri, dönüştürücü elemanların boyutlarını sınırladığı için, eleman boyutları oldukça küçülmüştür; bu da algılanan işareti oldukça zayıflatmaktadır. Bu nedenle, kabul edilebilir nitelikteki görüntülerin alınabilmesi için, alıcı-verici elektroniğinin iyileştirilmesi gerekmektedir. Bu çalışmada, iki boyutlu akustik çeviriciler için CMOS tabanlı ön alıcı-verici devresinin tasarımı gerçekleştirilmiştir. Devre, temel olarak, bir yüksek gerilim darbe üretici, alıcı-verici anahtarı, düşük gürültülü ön yükseltici ve dönüştürücü elemanın bağlantı dolgulamasından oluşmaktadır.Yayın An integrated circuit with transmit beamforming and parallel receive channels for real-time three-dimensional ultrasound imaging(IEEE, 2006) Wygant, Ira O.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Yeh, David T.; Oralkan, Ömer; Karaman, Mustafa; Khuri-Yakub, Butrus ThomasWe present the design of an integrated circuit (IC) that will be flip-chip bonded to a 16 x 16-element CMUT array. The IC provides 16 receive channels which can be configured to receive along either of the array diagonals or on any single row of the array. On transmit, all 256 elements can be used to transmit arbitrarily focused beams. Focused transmission with the full array is made possible by on-chip pulsers and memory. A 25-V pulser and 8-bit shift register is provided for each element of the array. Prior to each transmit, new values are loaded into the shift registers. Current-con trolled one-shots control the transmit pulse widths. Circuit simulations and the IC layout are presented. Simulations predict that delay values can be loaded in less than 1.3 mu s and show the generation of precisely timed pulses. The IC is being prepared for submission to National Semiconductor for fabrication in a high-voltage BiCMOS process.Yayın A parametric approach to describe distributed two-ports with lumped discontinuities for the design of broadband MMIC's(IEEE, 2003) Aksen, Ahmet; Yarman, Bekir Sıddık BinboğaThis paper addreses the use of mixed lumped and distributed elements in the matching equalizers of broadband microwave communication subsytems in MMIC realizations. Construction of two-variable scattering functions for lossless equalizers with mixed lumped-distributed elements is discussed. For the computer aided design and the simulation of lossless distributed two-ports with lumped discontinuity models, a parametric real frequency matching technique is presented. It is expected that the proposed tool will find practical applications for accurate representation of MMIC layouts. A matching network design example is included to systematically exhibit the implementation of the proposed approach.Yayın Broadband matching of PA-To-PCB interconnection for X-band wireless power transfer(Institute of Electrical and Electronics Engineers Inc., 2019-08) Köprü, RamazanDesign and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies (8-12 GHz). The source of the main energy can be wind, fossil, tidal, solar, nuclear, hydro etc. and the main energy can be converted from DC to microwave energy which then can be transmitted via the proposed WPT circuit towards a few or a network of a multiple microwave harvester receivers located at a near or far field from the main source. In the work, a bandpass matching network (BPMN) composed of microstrip "unit elements (UEs)" is designed to operate along the whole X-band (8-12 GHz). Designed BPMN is excited by an X-band commercial PA (power amplifier) MMIC (monolithic microwave integrated circuit) packaged chip, and it is loaded by an X-band microstrip patch antenna. A bond wire soldered between the RF output pad of MMIC chip and the input pad of the BPMN has an equivalent LC parasitic impedance assumed to be the generator complex impedance that must be compensated in a typical matching problem. SRFT (simplified real frequency technique) is used in the design of the matching network that compensates the effect of bond wire and very good agreement found between the theoretical design and simulations done in MWO (AWR).
