Broadband matching of PA-To-PCB interconnection for X-band wireless power transfer

Abstract

Design and simulation of a microwave wideband microstrip unit element bandpass matching network is presented, potential use might be a broadband WPT (microwave wireless power transfer) application in X-band frequencies (8-12 GHz). The source of the main energy can be wind, fossil, tidal, solar, nuclear, hydro etc. and the main energy can be converted from DC to microwave energy which then can be transmitted via the proposed WPT circuit towards a few or a network of a multiple microwave harvester receivers located at a near or far field from the main source. In the work, a bandpass matching network (BPMN) composed of microstrip "unit elements (UEs)" is designed to operate along the whole X-band (8-12 GHz). Designed BPMN is excited by an X-band commercial PA (power amplifier) MMIC (monolithic microwave integrated circuit) packaged chip, and it is loaded by an X-band microstrip patch antenna. A bond wire soldered between the RF output pad of MMIC chip and the input pad of the BPMN has an equivalent LC parasitic impedance assumed to be the generator complex impedance that must be compensated in a typical matching problem. SRFT (simplified real frequency technique) is used in the design of the matching network that compensates the effect of bond wire and very good agreement found between the theoretical design and simulations done in MWO (AWR).